Methods of making a core layer for an information carrying card, and resulting products

ABSTRACT

The disclosure provides a core layer for an information carrying card, resulting information carrying card, and methods of making the same. A core layer for an information carrying card comprises at least one thermoplastic layer having at least one cavity, an inlay layer, and, and a crosslinked polymer composition. At least one portion of the inlayer layer is disposed inside the at least one cavity of the at least one thermoplastic layer. The crosslinked polymer composition is disposed over the at least one thermoplastic layer and contacting the inlayer layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to U.S. Provisional Patent ApplicationNo. 61/794,409, filed Mar. 15, 2013, the entirety of which isincorporated by reference herein.

FIELD OF THE INVENTION

The disclosure relates to information carrying cards such as smartcards. More particularly, the disclosed subject matter relates to apolymer composition, an information carrying card comprising suchcomposition, and a method of making the same.

BACKGROUND OF THE INVENTION

Information carrying cards provide identification, authentication, datastorage and application processing. Such cards or parts include keycards, identification cards, telephone cards, credit cards, bankcards,tags, bar code strips, other smart cards and the like. Counterfeitingand information fraud associated with traditional plastic cards causestens of billions of dollars in the losses each year. As a response,information carrying cards are getting “smarter” to enhance security.Smart card technologies provide solutions to prevent fraud and decreaseresulting losses.

Information carrying cards often include an integrated circuit (IC)embedded in a thermoplastic material, such as polyvinyl chloride (PVC).Information has been input and stored in the integrated circuit before atransaction. In use, information carrying cards work in either a“contact” or “contactless” mode. In contact mode, an electroniccomponent on the card is caused to directly contact a card reader orother information receiving device to establish an electromagneticcoupling. In contactless mode, the electromagnetic coupling between thecard and the card reading device is established through electromagneticaction at a distance, without the need for physical contact. The processof inputting information into the IC of the information carrying cardalso works in either of these two modes.

When information carrying cards become “smarter,” the amount ofinformation stored in each card often increases, and the complexity ofthe embedded IC's also increases. The cards also need to withstandflexing to protect sensitive electronic components from damage as wellas offer good durability during use. A relatively easy and full-scalecommercial process having improved productivity at low cost is alsodesired.

SUMMARY OF THE INVENTION

The invention provides a core layer for an information carrying cardcomprising a cross-linked composition, an information carrying cardformed from the core layer comprising such a cross-linked composition,and methods for making the same.

In some embodiments, a core layer for an information carrying cardcomprises at least one thermoplastic layer having at least one cavity,an inlay layer, and a crosslinked polymer composition. At least oneportion of the inlayer layer is disposed inside the at least one cavityof the at least one thermoplastic layer. The crosslinked polymercomposition is disposed over the at least one thermoplastic layer andcontacting the inlayer layer. The inlay layer may comprise having atleast one active or passive electronic component. For example, the inlaylayer comprises at least one light emitting diode (LED) component or adisplay module in some embodiments. The inlay layer may also comprise atleast one of a metal containing sheet and a ceramic containing sheet.The crosslinked polymer composition is obtained from a cross-linkablepolymer composition, which comprises a curable precursor. In someembodiments, such a curable precursor or a base unit for the crosslinkedpolymer composition is selected from the group consisting of acrylate,methacrylate, urethane acrylate, ester acrylate, silicone acrylate,epoxy acrylate, silicone, epoxy and urethane. The curable precursor maycomprise a monomer, an oligomer or a prepolymer. The crosslinked polymercomposition may or may not contain any filler. In additionalembodiments, an information carrying card comprises a core layer asdescribed above.

A method for forming a core layer of an information carrying card isprovided by the invention. In one embodiment, the method comprises stepsof forming a first thermoplastic layer having at least one cavity,disposing at least a portion of an inlay layer into the at least onecavity, and dispensing a crosslinkable polymer composition over theinlay layer. In some embodiments, the method further comprises a step ofapplying vacuum to the crosslinkable polymer composition. Thecross-linkable polymer composition used in such a method comprises acurable precursor in a liquid or paste form. The cross-linkable polymercomposition may or may not comprise fillers. The method of making a corelayer may further comprise fixing the inlay layer onto the firstthermoplastic layer before dispensing the crosslinkable polymercomposition. In further embodiments, a method of making a core layerfurther includes a step of curing the crosslinkable polymer compositionunder a pressure to form crosslinked polymer composition, for example ata predetermined temperature under pressure, optionally with radiationsuch as UV light.

In some embodiments, curing the crosslinkable polymer composition underpressure comprises pressing a sandwich structure between two metalplates spaced by a metal frame having a controlled thickness. Thesandwich structure comprises a first thermoplastic layer, an inlay layerand a crosslinkable polymer composition. The two metal plates have apolished surface in some embodiments. The step of curing thecrosslinkable polymer composition under pressure comprises: providing afirst metal plate, placing a metal frame with a controlled thicknessover the first metal plate to form a cavity above the first plate,applying sandwich structure comprising an inlayer layer and acrosslinkable polymer composition into the cavity above the first metalplate, and placing a second metal plate above the metal frame. The metalframe is fixed onto the first metal frame using an adhesive in someembodiments. The sandwich structure inside the cavity above the firstmetal frame can be cured under pressure and heat, for example, asuitable thermal lamination condition.

The invention also provides a method for fabricating an informationcarrying card comprising forming a core layer of the informationcarrying card of the invention. The method may further comprise heatlaminating a printable thermoplastic film and a transparentthermoplastic film on each side of the core layer of the card.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is best understood from the following detaileddescription when read in conjunction with the accompanying drawings. Itis emphasized that, according to common practice, the various featuresof the drawings are not necessarily to scale. In some instances, thedimensions of the various features are arbitrarily expanded or reducedfor clarity. Like numerals denote like features throughout thespecification and the figures.

FIGS. 1-6 illustrate cross sectional views of layered structures atdifferent steps in an exemplary process of forming a core layer of aninformation carrying card, in accordance with some embodiments.

FIG. 1 illustrates a cross sectional view of a first release film.

FIG. 2 illustrates a cross sectional view of a second release filmdisposed over the first release film of FIG. 1.

FIG. 3 illustrates a cross sectional view of a first thermoplastic layerhaving at least one cavity disposed over the two release films of FIG.2.

FIG. 4 is a cross sectional view of the layers after an inlay layer isdisposed partially or fully inside the cavity of the first thermoplasticlayer of FIG. 3.

FIG. 5 is a cross sectional view of the layers of FIG. 4 after acrosslinkable polymer composition is dispensed over the inlay layerinside the cavity.

FIG. 6 is a cross sectional view of the resulting layers after placing athird and a forth release film over the layers of FIG. 5.

FIG. 7 is a flow chart diagram illustrating an exemplary process offorming a core layer of an information carrying card, in accordance withsome embodiments.

FIG. 8 is a flow chart diagram illustrating another exemplary processforming a core layer of an information carrying card, in accordance withsome embodiments.

FIG. 9 is a flow chart diagram illustrating an exemplary process forminga thermoplastic layer having a cavity, in accordance with someembodiments.

FIGS. 10-13 illustrate cross sectional views of layered structures atdifferent steps in the exemplary process of FIG. 9.

FIG. 14 is a cross sectional view of an exemplary core layer of aninformation carry card, which is fabricated according to the structurein FIGS. 1-6 and steps in FIG. 8.

FIG. 15 is a cross sectional view of another exemplary core layer of aninformation carry card at a final stage according to the steps in FIG. 8in some embodiments.

FIG. 16 is a cross sectional view of an exemplary core layer of aninformation carry card having a full open cavity for an inlay, inaccordance with some embodiments.

FIG. 17 is a top down view of the exemplary core layer of an informationcarry card of FIG. 16.

FIG. 18 is a cross sectional view of an exemplary core layer of aninformation carry card having an open inlay cavity close to the size ofan inlay, in accordance with some embodiments.

FIG. 19 is a top down view of the exemplary core layer of an informationcarry card of FIG. 18.

FIG. 20 is a cross sectional view of an exemplary core layer of aninformation carry card having a window cavity partially for an inlay, inaccordance with some embodiments.

FIG. 21 is a top down view of the exemplary core layer of an informationcarry card of FIG. 13.

FIGS. 22-25 illustrate an exemplary process for fixing an exemplaryinlay layer onto a thermoplastic layer, in accordance with someembodiments.

FIG. 22 is a top down view of an exemplary inlay layer.

FIG. 23 is a top down view of the exemplary inlay layer of FIG. 22 aftercut with holes in its supporting layer.

FIG. 24 is a top down view of the exemplary inlay layer of FIG. 23disposed over a thermoplastic layer.

FIG. 25 is a top down view of the exemplary inlay layer of FIG. 24 whichis fixed onto the thermoplastic layer using an instant adhesive, inaccordance with some embodiments.

FIG. 26 is a flow chart diagram illustrating an exemplary process offixing an inlay layer onto a thermoplastic layer, in accordance withsome embodiments.

FIGS. 27-31 illustrate cross sectional views of the layer structure atdifferent steps of an exemplary process of making an exemplaryinformation carrying card, in accordance with some embodiments.

FIG. 27 is a cross sectional view of a transparent film.

FIG. 28 is a cross sectional view of a printable film disposed over thetransparent film of FIG. 27.

FIG. 29 is a cross sectional view of the layer structure after anexemplary core layer is disposed over the two films of FIG. 28.

FIG. 30 is a cross sectional view of the resulting layer structure aftera second printable film is disposed over the layer structure of FIG. 29.

FIG. 31 is a cross sectional view of the resulting layer structure aftera second transparent film is disposed over the layer structure of FIG.30.

FIG. 32 is a flow chart diagram illustrating an exemplary process ofmaking an exemplary information carrying card.

FIG. 33 is a schematic drawing illustrating an exemplary core layerstructure for a plurality a plurality of information carrying cardsduring an exemplary manufacturing process, in accordance with someembodiments.

FIG. 34 illustrates a cross sectional view of a first metal plate.

FIG. 35 illustrates a cross sectional view of a metal frame placed abovethe first metal frame to form a cavity above the first metal plate inaccordance with some embodiments.

FIG. 36 illustrates a cross sectional view of a structure after asandwich structure comprising an inlay layer, a first thermoplasticlayer and a crosslinkable polymer composition is applied into the cavityabove the first metal plate.

FIG. 37 illustrates a cross sectional view of a structure after a secondmetal plate above the structure of FIG. 36.

FIG. 38 is a flow chart illustrating a process of curing a crosslinkablepolymer composition under pressure to form an core layer of aninformation carrying card having a crosslinked polymer composition inaccordance with some embodiments.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

This description of the exemplary embodiments is intended to be read inconnection with the accompanying drawings, which are to be consideredpart of the entire written description. In the description, relativeterms such as “lower,” “upper,” “horizontal,” “vertical,”, “above,”“below,” “up,” “down,” “top” and “bottom” as well as derivative thereof(e.g., “horizontally,” “downwardly,” “upwardly,” etc.) should beconstrued to refer to the orientation as then described or as shown inthe drawing under discussion. These relative terms are for convenienceof description and do not require that any apparatus to be constructedor operated in a particular orientation. Terms concerning attachments,coupling and the like, such as “connected” and “interconnected,” referto a relationship wherein structures are secured or attached to oneanother either directly or indirectly through intervening structures, aswell as both movable or rigid attachments or relationships, unlessexpressly described otherwise.

For brevity, unless expressly stated otherwise, references to“information carrying card” or “smart card” made throughout thisdescription are intended to encompass at least key cards, identificationcards, telephone cards, credit cards, bankcard, power cards, tags, barcode strips, any part comprising an integrated circuit (IC), and thelike. “Information carrying card” or “smart card” also includes a widevariety of shapes, which include but are not limited to rectangularsheets, circular sheets, strips, rods and rings. “Information carryingcard” or “smart card” also includes any information carrying parts ofboth “contact” and “contactless” modes. “Information carrying card” or“smart card” also encompasses any information carrying cards with orwithout an on-board power supply. An information carrying cardcomprising a power supply is also referred as a “power card.”

1. Core Layer for Information Carrying Card:

In some embodiments, a core layer for an information carrying cardcomprises at least one thermoplastic layer having at least one cavity;an inlay layer, and a crosslinked polymer composition. At least oneportion of the inlayer layer is disposed inside the at least one cavityof the at least one thermoplastic layer. The crosslinked polymercomposition is disposed over the at least one thermoplastic layer andcontacting the inlayer layer. In some embodiments, the crosslinkedpolymer composition is disposed into the cavity over the at least onethermoplastic layer.

The crosslinked polymer composition may comprise a base unit selectedfrom the group consisting of acrylate, methacrylate, urethane acrylate,ester acrylate, silicone acrylate, epoxy acrylate, silicone, urethane,epoxy and the like. In some embodiments, the crosslinked polymercomposition comprises a base unit selected from the group consisting ofacrylate, methacrylate, urethane acrylate, ester acrylate, siliconeacrylate, and silicone. For example, the crosslinked polymer compositionis acrylate or urethane acrylate. The crosslinked polymer may beunfilled, or comprise a filler or additive, such as in the range ofabout 0.5 wt. % to about 80 wt. % of a filler. The filler can beinorganic or organic. The cross-linked polymer composition is madethrough curing a cross-linkable polymer composition comprising a curableprecursor. The curable precursor is acrylate, methacrylate, urethaneacrylate, ester acrylate, silicone acrylate, epoxy acrylate, silicone,urethane, epoxy or the like in some embodiments.

In some embodiments, the inlay layer comprises at least one active orpassive electronic component, e.g., an integrated circuit (IC). Forexample, the inlay layer may comprise a printed circuit board. The inlaylayer comprises LED components in some embodiments. The at least oneelectronic component is partially or fully disposed inside the cavityover the at least one thermoplastic layer. The size of the at least onecavity on the first thermoplastic layer is larger than the size of theinlay layer in some embodiments. The size of the at least one cavity onthe first thermoplastic layer is substantially the same as the size ofthe inlay layer in some other embodiments. The size of the at least onecavity on the first thermoplastic layer is substantially the same as thesize of a portion of the inlay layer in some other embodiment. The inlaylayer may also comprise at least one sheet of metal, ceramic, metalcontaining material, ceramic containing material, plastics or the like.The core layer may further comprises a battery connected with the atleast one electronic component in the inlay layer.

This invention also provides a method for forming such a core layer ofan information carrying card.

Referring to FIGS. 1 and 2, first release film 2 may be a sheet ofpolytetrafluoroethylene under the trade name Teflon®, any otherfluoropolymer, silicone, a fluoropolymer or silicone coated films. Asecond release film 4 is disposed over first release film 2. Secondrelease film 4 can be formed from the same material and process as firstrelease film 2. In some embodiments, a breathable release film ispreferred. Examples of a breathable release film as second release film4 is a silicone coated paper. For example, second release film 4 maytake the form of a silicone coated, unbleached parchment baking paper,available from Regency Wraps company under the trade name of “If youcare.” The two release films are shown for the purpose of illustrationonly. Only one or no release film may be used in some embodiments.

Referring to FIG. 3, a first thermoplastic layer 6 has at least onecavity 7, which is disposed over release films 2 and 4. Firstthermoplastic layer 6 can be molded or laminated from one or more layersof thermoplastic films. Examples of materials that are suitable for usein forming first thermoplastic layer 6 include polyvinyl chloride (PVC),a copolymer of vinyl chloride, polyolefin, polycarbonate, polyester,polyamide, acrylonitrile butadiene styrene copolymer (ABS), and thelike. The first thermoplastic layer 6 may be a PVC, or a copolymer ofvinyl chloride and another monomer such as vinyl ether, vinyl ester orvinyl acetate, or a compound or blend of PVC and a vinyl chloridepolymer. Examples of PVC films suitable for use with the invention areavailable from suppliers such as Klockner Pentaplast of America, Inc. ofGordonsville, Va.; and Shijiazhuang Eurochem Co. Ltd of China. Examplesof such copolymer resins are available from Dow Chemical Company undertrade name of UCAR®, and from BASF of Ludwigshafen, Germany under tradename of Laroflex®. UCAR® is a copolymer of vinyl chloride and vinylacetate. The grades include YYNS-3, VYHH and VYHD. Laroflex® is acopolymer of vinyl chloride and vinyl isobutyl ether. The grades includeMP25, MP 35, MP45 and MP60. All of these polymer resins may be suppliedas fine powder. A powder of these copolymers can be added to modify PVCresins for films. First thermoplastic layer 6 having at least one cavitycan be formed by die-cutting one or more thermoplastic film and thenlaminating and heating one or more thermoplastic films.

Referring to FIG. 4, at least one portion of an inlay layer 8 isdisposed inside at least one cavity 7 of the first thermoplastic layer6. The inlay 8 is partially or fully disposed inside cavity 7. Inlaylayer 8 comprises at least one active or passive electronic component 10embedded or surface mounted on a supporting film 12. Inlay layer 8 maycomprise a printed circuit board (PCB). Electronic component 10 may beembedded or surface mounted on the PCB supporting material. Examples ofsupporting film 12 include but are not limited to polyimide, polyestersuch as PET, glass filled epoxy sheet such as FR-4. A printed circuitboard (PCB) having all the components are abbreviated as PCBa. Forbrevity, the references to PCB in this disclosure will be understood toencompass any PCBs including PCBa. Examples of electronic component 10inside inlay layer 8 include but are not limited to active or passiveelectronic components, e.g., an integrated circuit (IC), a battery for a“power card,” an antenna, and a functional component such as lightemitting diodes (LED). Electronic components are interconnected viawires or traces 14. Supporting film 12 may be a polymer based dielectricmaterial. Inlay layer 8 may have any dimension relative to the size of acavity in first thermoplastic layer 6. Inlay layer 8 may be partially orfully disposed in such a cavity. In some embodiments, the size of thecavity on first thermoplastic layer 6 is larger than the size of inlaylayer 8. Inlay layer 8 may be fully disposed in the cavity. In someembodiments, the size of the cavity in first thermoplastic layer 6 issubstantially the same as or slightly larger than the size of inlaylayer 6 of PCB. The shape of the cavity often matches with the shape ofinlay layer 8. In some embodiments, the size of the at least one cavityon first thermoplastic layer 6 is less than the size of inlay layer 8.The size of the at least one cavity is substantially the same as orslightly larger than a portion of inlay layer 8 of the PCB. For example,the shape and size of one cavity may match with one electronic component10. Examples of electronic component 10 include but are not limited to abattery or an active or passive electronic component, e.g., anintegrated circuit (IC) in inlay layer 8. In some embodiments, inlaylayer 8 may comprise a piece or a sheet of metal, ceramic, metalcontaining material, ceramic containing material, plastic or the like.Examples of suitable materials for this piece or sheet include but arenot limited to platinum, copper, tungsten, metallized power containingmaterials, alumina, silica, and ceramic powder containing materials.This piece or sheet may be in a certain color or weight, having certainvisual or other sensational characteristics.

Referring to FIG. 5, the resulting layer is shown, after across-linkable polymer composition 16 is dispensed over the firstthermoplastic layer 6, and the inlay layer 8 inside the cavity 7. Thecrosslinkable polymer composition 16 may be also dispensed over thefirst thermoplastic layer 6 outside the cavity some embodiments. Across-linkable polymer composition 16 formed in accordance with theinvention often comprises a curable precursor, in a liquid or pasteform. Such a curable precursor may be acrylate, methacrylate, urethaneacrylate, silicone acrylate, epoxy acrylate, urethane, epoxy, siliconeor the like. The crosslinkable polymer composition may be unfilled insome embodiments, and comprises filler or other additives in some otherembodiments. The crosslinkable polymer composition may comprise in therange of about 0.5 wt. % to about 80 wt. % of the filler. The filler canbe inorganic or organic filler. For example, the filler can be aparticulate thermoplastic filler such as polyolefin, polyvinyl chloride(PVC), a copolymer of vinyl chloride and at least another monomer, or apolyester such as polyethylene terephthalate (PET). The at least anothermonomer in the vinyl chloride co-polymer filler may be vinyl ester,vinyl acetate or vinyl ether in some embodiments. The particulatethermoplastic filler may be a compound or a blend comprising athermoplastic resin, for example, a compound or a blend comprising PVC.

The curable precursor in the crosslinkable polymer composition 16 maycomprise a monomer, an oligomer or pre-polymer having functional groups.The precursor may be cross-linkable under a regular curing conditionsincluding but not limited to heating, radiation such as ultraviolet (UV)light, moisture and other suitable conditions. The curable precursor maybe in liquid or paste form. Its viscosity may be in the range of1-100,000 cps. In some embodiments, the curable precursor is urethaneacrylate. These curable precursors are readily available from specialtychemical suppliers. Examples of these suppliers include but are notlimited to Dymax Corporation of Torrington, Conn. and Sartomer USA, LLCof Exton, Pa.

In some embodiments, a particulate thermoplastic filler may be used.Examples of a thermoplastic filler include, but are not limited topolyolefin, PVC, polyester, copolymer, terpolymer and the like. Apowdered polymer that provides adequate results may be a compound or ablend comprising PVC, or a modified PVC. The particulate thermoplasticfiller can be a copolymer of vinyl chloride and at least anothermonomer, which may be vinyl ester, vinyl acetate or vinyl ether.Examples of such a copolymer are available from Dow Chemical Companyunder trade name of UCAR™, and from BASF of Ludwigshafen, Germany undertrade name of Laroflex™. UCAR™ is a copolymer of vinyl chloride andvinyl acetate. The grades include YYNS-3, VYHH and VYHD. Laroflex™ is acopolymer of vinyl chloride and vinyl isobutyl ether. The grades includeMP25, MP35, MP45 and MP60. All of these polymer resins are oftensupplied in the form of fine powder. Particulate thermoplastic fillermight be obtained through suspension or emulsion polymerization of oneor more corresponding monomers or, through pulverization of solidplastics. The particulate form can be of any size, by way of example andnot limitation. The particles may be in the range of 0.5-200 microns. Insome embodiments, the particles are in the range of 1-1000 nm.

Cross-linkable polymer composition 16 may further comprise at least onecurative based on general principles of polymer chemistry. Such across-linkable polymer composition 16 becomes a solid cross-linkedcomposition 18 after curing. Preferably, such a cross-linked composition18 is more flexible than the first thermoplastic layer 6 in someembodiments. For example, the cross-linkable composition 16 comprises afirst curative for thermal curing and a second curative for radiationcuring. During the curing or cross-linking reaction, such across-linkable composition transforms into a solid cross-linked polymercomposition. Such a cross-linked polymer composition 18 is also known inthe art as a “thermosetting” polymer or “thermoset” to distinguish itfrom a thermoplastic polymer. In some embodiments, the cross-linkablepolymer composition is unfilled. In some other embodiment, thecross-linkable polymer composition comprises a range of about 0.5 wt. %to about 80 wt. %, and preferably in the range of about 5 wt. % to about50 wt. %, of a filler.

Examples of a suitable crosslinkable polymer composition 16 include butare not limited to a formulation comprising a curable precursor such asacrylate or urethane acrylate. Examples of such a formulation includebut are not limited to X-685-31-1 and X-685-31-2, available from DymaxCorporation of Torrington, Conn. X-685-31-1 is a formulation comprisingisobornyl acrylate, 2-hydroxyethyl methacrylate,2-hydroxy-3-phenoxypropyl acrylate, t-butyl perbenzoate and aphotoinitiator. Its viscosity is 1047 cP. X-685-31-2 is also aformulation comprising isobornyl acrylate, 2-hydroxyethyl methacrylate,2-hydroxy-3-phenoxypropyl acrylate, t-butyl perbenzoate and aphotoinitiator. Its viscosity is 1025 cP. These formulations weredispensed over the inlay layer, and then cured at a raised temperatureof less than 150° C. under a pressure of less than 2 MPa. The resultingcore layer and resulting information carrying cards were successfullymade. These examples are only intended to illustrate embodiments inaccordance with the invention, and as such should not be construed asimposing limitations upon the claims.

Cross-linkable polymer composition 16, which is packed in a syringe, canbe dispensed using the standard dispensing apparatus or equipment foradhesives, encapsulants, sealants and potting compounds. The amount tocross-linkable composition 16 to be dispensed can be calculated andcontrolled based on the volume of the cavity and the inlay layer 8.

In some embodiments, the crosslinkable polymer composition 16 is degasedin a vacuum chamber after being dispensed over the first thermoplasticlayer 6. The degassing process through vacuum can be done without anycover sheet over the structure of FIG. 5 in some embodiments.Optionally, a second thermoplastic layer (not shown) is disposed overthe structure of FIG. 5 before the vacuum process. The secondthermoplastic layer comprises a thermoplastic material selected frompolyvinyl chloride, copolymer of vinyl chloride, polyolefin,polycarbonate, polyester, polyamide, and acrylonitrile butadiene styrenecopolymer (ABS). The second thermoplastic layer might be the same as thefirst thermoplastic layer 6. Its thickness may be in the range of 0.025mm to 0.25 mm. This thermoplastic layer becomes a part of the core layerif used. In some other embodiments, at least one of the release films inFIG. 6 is disposed over the structure of FIG. 5 before the vacuumprocess.

Referring to FIG. 6, the resulting layers after placing a third and aforth release film over the layers shown in FIG. 5, form a sandwichstructure. The third and fourth release films can be any kind of releasefilms, and in some embodiments, second and third release films 4 areformed of the same material. The first and fourth release films 2 aremay also be formed from the same materials. For example, in someembodiments, the second and third release films 2 may be formed from abreathable silicone coated paper. The first and fourth release films 4are often formed from a fluoropolymer such as polytetrafluoroethyleneoften offered under a trade name of Teflon®. The two release films areshown for the purpose of illustration only. Only one or no release filmmay be used in some embodiments. The resulting sandwich or layeredstructure of FIG. 6 is placed under pressure and heated to form a corelayer for an information carrying card, as illustrated in the exemplaryprocess of FIGS. 7 and 8.

Referring to FIG. 7, a process 20 forming a core layer of an informationcarrying card, in accordance with some embodiments includes thefollowing steps. At step 24, a first thermoplastic layer 6 having atleast one cavity 7 is formed. A first thermoplastic layer 6 has at leastone cavity 7 can be molded or laminated.

In some embodiments, the first thermoplastic layer 6 is formed throughsteps of die-cutting one or more thermoplastic films; and then hotlaminating with one or more uncut thermoplastic films. For example, sucha first thermoplastic layer 6 can be made using a process 61 illustratedin FIG. 9. The cross-section views of the structure are shown in FIGS.10-13. Referring to FIG. 10, one or more thermoplastic films 63 areprovided. The films 63 can be in the range of 0.025 mm to 0.5 mm inthickness. Referring to FIG. 9, one or more thermoplastic films 63 arecut at step 62, to form a structure shown in FIG. 11. The one or morecut films 63 are placed above another thermoplastic film 65 at step 64of FIG. 9, resulting in a structure illustrated in FIG. 12. An exemplaryfilm 65 can be in the range of 0.025 mm to 0.25 mm in thickness. Thecombination of the one or more films 63 and film 65 are then laminatedtogether at step 66 of FIG. 9 to form a first thermoplastic layer 6having at least one cavity 7 as shown in FIG. 13.

At step 27 of FIG. 7, at least one portion of an inlay layer 8 isdisposed into the at least one cavity 7. In some embodiments, the sizeof the at least one cavity on first thermoplastic layer 6 is larger thanthe size of the inlay layer 8. In some embodiments, the size of the atleast one cavity on first thermoplastic layer 6 is substantially thesame as the size of the inlay layer 8. In other embodiments, the size ofthe at least one cavity on first thermoplastic layer 6 is substantiallythe same as the size of a portion of the inlay layer 8.

At step 30 which is optional, the inlay layer 8 is fixed on the firstthermoplastic layer 6. In some embodiments, inlay layer 8 is fixed onfirst thermoplastic layer 6 using an instant adhesive, a solder or thelike. For example, a plurality of holes is formed on the inlay layer 8by cutting some portions of supporting film 12 without any electroniccomponent 10 and interconnects 14. An instant adhesive is applied to theholes. Examples of an instant adhesive include but are not limited tocyanoacrylate. Inlay layer 8 can be fixed to first thermoplastic layer 6in a period as short as a few seconds.

At step 32 (FIG. 7), a crosslinkable polymer composition 16 is dispensedover inlay layer 8. In some embodiments, the crosslinkable polymercomposition 16 is dispensed into the cavity 17. The cross-linkablepolymer composition may directly contact the electronic components 10including active or passive electronic components, e.g., an integratedcircuit (IC). The amount of cross-linkable polymer composition 16 ispredetermined and controlled. Any extra material exceeding the topsurface of first thermoplastic layer 6 may be removed. In someembodiments, the curable precursor in the crosslinkable polymercomposition 16 is unfilled acrylate or urethane acrylate. In someembodiments, the crosslinkable polymer composition comprises aparticulate thermoplastic filler such as PVC, a compound or a blendcomprising PVC, or a copolymer of vinyl chloride and at least anothermonomer such as vinyl ester or vinyl ether.

Process 20 may also comprise an optional step 33. At step 33, a secondthermoplastic layer is disposed above first thermoplastic layer 6 afterstep 32. The second thermoplastic layer might be the same as the firstthermoplastic layer 6. Its thickness may be in the range of 0.025 mm to0.25 mm. This thermoplastic layer becomes a part of the core layer ifused.

At step 35, a vacuum is applied onto the crosslinkable polymercomposition 16 in a vacuum chamber. The pressure range is in the rangeof 10 Pa to 1000 Pa. The vacuum can be maintained for 0.5 to 10 minutes,preferably 1-3 minutes. The vacuum is released in the end of a cycle.One or multiple cycles can be used to achieve a bubble free sample. Sucha vacuum process is performed at low temperature, preferably at roomtemperature.

At step 37, at least one release film such as release film 2 or 4described in FIG. 6 is provided above the first thermoplastic layer 6. Arelease film 2 or 4 is placed above the second thermoplastic layer ifthe second thermoplastic layer is used.

At step 39, the crosslinkable polymer composition 16 is cured to form acrosslinked polymer composition 18. This curing process can be achievedunder pressure through a thermal curing method. An additional curing canbe performed through a radiation curing mechanism.

Referring to FIG. 8, a process 21 forming a core layer of an informationcarrying card, in accordance with some embodiments includes thefollowing steps. At step 22, a second release film 4 is placed above afirst release film 2. At step 24, a first thermoplastic layer 6 havingat least one cavity is formed. A first thermoplastic layer 6 has atleast one cavity 7 can be molded or laminated. In some embodiments, thefirst thermoplastic layer 6 is formed through steps of die-cutting oneor more thermoplastic films; and then hot laminating with one or moreuncut thermoplastic films.

At step 26, first thermoplastic layer 6, having at least one cavity, isplaced above first and second release film (4 and 6). At step 28, aninlay layer 8 is placed at least partially into the at least one cavityon first thermoplastic layer 6. The inlay layer 8 may comprise a printedcircuit board (PCB). In some embodiments, the size of the at least onecavity on first thermoplastic layer 6 is larger than the size of theinlay layer 8 of the PCB. In some embodiments, the size of the at leastone cavity on first thermoplastic layer 6 is the same as the size of theinlay layer 8 of PCB. In other embodiments, the size of the at least onecavity on first thermoplastic layer 6 is the same as the size of aportion of the inlay layer 8 of PCB.

Following step 28, the process optionally comprises step 30 of fixingthe inlayer onto the first thermoplastic layer 6, for example, using aninstant adhesive, a solder ball, or the like. At step 32, acrosslinkable polymer composition 16 is dispensed over the inlay layer8. At step 35, a vacuum is applied to eliminate any bubble incrosslinkable polymer composition 16.

At step 34, third release film and fourth release film 4 are placed onthe layered structure to form a sandwich structure (FIG. 6). The thirdrelease film is placed first followed by the fourth release film. Insome embodiments, the third release film is formed from the samematerial as the second release film 4, which is preferably a breathablerelease film. The fourth release film may be formed from the samematerial as first release film 2. In some embodiments, the first andfourth release films are a polytetrafluoroethylene (under the trade nameTeflon®) sheet. At step 36, the layered structure above is placed underpressure, e.g., a pressure of less than about 2 MPa.

At step 38, the layered structure is heated under pressure. A suitabletemperature would be one that is sufficiently high to partially or fullycure the cross-linkable polymer composition 16, or hot laminating firstthermoplastic film 6, or both. After the heat treatment, thecross-linkable polymer composition 16 forms a solid. Such a cross-linkedpolymer composition 18 has good adhesion with first thermoplastic layer6 and inlay layer 8 including electronic component 10 and supportingfilm 12. In some embodiments, such a cross-linked composition is moreflexible than first thermoplastic film 6. In some embodiments, thetemperature is in the range of 65-232° C. In some embodiments, thetemperature is less than 150° C.

Process 21 may further comprise cooling the layer structure and peelingoff the first, second, third and fourth release films. Process 21 mayfurther comprise a step of curing the cross-linkable polymer composition16 using visible light, UV or other radiation curing. It may alsocomprise a step of curing via the introduction of moisture or thepromotion of other chemical reactions. After process 21, thecross-linkable polymer composition 16 is cured so as to yield a solid.After the release films are peeled away, a core layer for an informationcarrying card is formed. The core layer comprises a first thermoplasticlayer 6, an inlay layer 8 and a cross-linked polymer composition 18. Thecrosslinkable polymer composition 16 becomes into the crosslinkedpolymer composition 18 in solid state. Different reference numerals areused for the purpose of differentiation only even though they may sharethe same chemical composition. The exemplary core layers for aninformation carrying card from process 21 are shown in FIG. 14-21.

Referring to FIG. 14, an exemplary core layer 80 of an information carrycard, is fabricated according to the structure depicted FIG. 1-6 andsteps of FIG. 7 or 8. More particularly, the exemplar core layer 80comprises a first thermoplastic layer 6, an inlay layer 8, and across-linked polymer composition 18. First thermoplastic layer 6 ispolyvinyl chloride (PVC), a copolymer of vinyl chloride, polyolefin,polycarbonate, polyester, polyamide, acrylonitrile butadiene styrenecopolymer (ABS), or the like. Cross-linked polymer composition 18 isformed from a cross-linkable composition 16 as described in relatedsections above. Inlay layer 8 comprises electronic components 10, forexample, at least one printed circuit board (PCB), supporting film 12and interconnects 14. The electronic components, such as a battery andan active or passive electronic components 10, are connected withinterconnects 14. Electronic components 10 are embedded on supportingfilm 14. The cross-linked polymer composition 18 fills the voids andremaining spaces inside the cavity on first thermoplastic layer 6 andinlay layer 8. In some embodiments, the cross-linked polymer composition18 directly contacts the outer surface of electronic components 10.Referring once again to FIG. 4, inlay layer 8 may have any dimensionrelative to the size of a cavity in the first thermoplastic layer 6.Inlay layer 8 may be partially or fully disposed into such a cavity.

Referring to FIG. 15, another exemplary core layer 81 of an informationcarry card at a final stage according to the steps in FIG. 8 in someembodiments. It is similar to the core layer 80 of FIG. 14. In someembodiments, the crosslinked polymer composition 18 from thecrosslinkable polymer composition 16 is disposed above the firstthermoplastic layer 6 outside the cavity 7, for example, in the range of1 micron to 100 micron in thickness.

Referring to FIGS. 16-21, different configurations of core layers for aninformation carrying card may also be utilized with good effect.Referring to FIG. 16, an exemplary core layer 82 of an information carrycard includes a full open cavity for an inlay. In FIGS. 16 and 17, thesize of a cavity on the first thermoplastic layer 6 is larger than thesize of inlay layer 8. In some embodiments, such a cavity is close tobut slightly smaller than the size of an information carrying card.Inlay layer 8 is fully disposed into the cavity. The shape of the cavitymay not be the same as the shape of inlay layer 8.

Referring FIGS. 18 and 19, an exemplary core layer 86 of an informationcarry card includes an open inlay cavity close to the size of an inlaylayer 8. In FIGS. 18 and 19, the size of a cavity on the firstthermoplastic layer 6 is substantially the same as or slightly largerthan the size of inlay layer 8. The shape of the cavity matches with theshape of inlay layer 8. In this configuration, inlay layer 8 can befully disposed inside the cavity on the first thermoplastic layer 6. Thegap between the edge of the first thermoplastic layer 6 and inlay layer8 might be smaller than the gap shown in FIGS. 18 and 19.

Referring to FIGS. 20 and 21, an exemplary core layer 90 of aninformation carry card includes a window cavity partially for an inlay.In FIGS. 20 and 21, the size of the at least one cavity on the firstthermoplastic layer 6 is less than the size of inlay layer 8. The sizeof the at least one cavity is substantially the same as or slightlylarger than a portion of inlay layer 8. In some embodiments, a portionof inlay layer is cut open for form one or more holes so that anelectronic component 10 can be fit into one of the holes. Examples ofsuch an electronic component 10 include but are not limited to a batteryor a chip in the inlay layer 8. In some embodiments, the electroniccomponent 10 in inlay layer 8 is inserted from one side of the firstthermoplastic layer 6. During the fabrication process, a crosslinkablecomposition 16 for the crosslinked polymer composition 18 can be appliedto from the other side of the first thermoplastic layer 6.

Referring to FIGS. 22-26, an exemplary process 120 fixing an exemplaryinlay layer 8 onto a thermoplastic layer 6 using an instant adhesive, inaccordance with some embodiments, includes the following steps listed inFIG. 26. An inlay layer is first provided. Referring to FIG. 22, anexemplary inlay layer 8 is used as a model for demonstration purpose.The electronic components used for a core layer of an informationcarrying card are not limited to the components illustrated in FIG. 22.Inlay layer 8 comprises a supporting film 12, a battery 102, a chip 104having at least one integrated circuit (IC), metal structures 106, metalinterconnect wires 108, and functional components such as LED 109.Supporting film 12 is a polymer based dielectric material in someembodiments. This inlay layer is suitable for a “power card.” In someembodiments, the method for forming a core layer of an informationcarrying card can comprise a step of forming an inlay layer, forexample, an inlay layer having a display module configured to displayinformation in the final information carrying card. For example, thedisplay module can comprise LED components, and/or a phosphor materialin at least one seven-segment display. The display module is configuredto display a one time passcode, which can comprises at least one digits,for example, 3-6 digits.

In step 122 (FIG. 26), a plurality of holes are formed by cutting theinlay layer 8 on the portions of the supporting film 12 without anyelectronic components and interconnect wires. Referring to FIG. 23, theexemplary inlay layer 8 includes a plurality of holes 112 in itssupporting layer 12 after cut. The holes can be of any shape and anysize. Examples of the shape of the holes include but are not limited tocircle, rectangle, square or any other shape. Step 122 is optional insome embodiments. The inlay layer is fixed onto the first thermoplasticlayer 6 without cutting holes.

In step 124, the resulting inlay layer 8 having holes is placedpartially or fully inside a cavity of the first thermoplastic layer 6.The exemplary inlay layer 8 may have any dimension relative to size of acavity in the first thermoplastic layer 6. The exemplary inlay layer 8may be partially or fully disposed into such a cavity. Referring to FIG.24, the exemplary inlay layer 8 having a plurality of holes is disposedover a first thermoplastic layer 6 having an open inlay cavity. Theexemplary first thermoplastic layer has a cavity bigger than the inlaylayer so that the inlay layer is fully disposed into the cavity on thefirst thermoplastic layer 6.

In step 126, a small amount of an instant adhesive is applied into eachhole 112. Referring to FIG. 25, the exemplary inlay layer 8 is fixedonto the thermoplastic layer 6 using an instant adhesive 115 form theresulting structure 116, in accordance with some embodiments. Examplesof an instant adhesive 115 include but are not limited to cyanoacrylate.In some embodiments, the instant adhesive 115 cures fast in a fewseconds. Such a fixing process used in this disclosure is understood toencompass any process of fixing an inlay layer 8 onto the firstthermoplastic layer 6 using any other adhesive or the like.

In some embodiments, curing the crosslinkable polymer composition underpressure comprises pressing a sandwich structure between two metalplates spaced by a metal frame having a controlled thickness. Thesandwich structure comprises a first thermoplastic layer, an inlay layerand a crosslinkable polymer composition. The two metal plates have apolished surface in some embodiments. Referring to step 39 of FIG. 7 orsteps 36 and 38 can comprises steps in FIG. 38 with the step-by-stepstructure illustrations in FIGS. 34-37.

Referring to FIG. 38, at step 202, a first metal plate 192 is provided,as illustrated in FIG. 34. The first metal plate 192 has a polishedsurface in some embodiments. Example of the first metal plate 192include but are not limited to steel and any other suitable metal.

At step 204, a metal frame 194 (or called shim) with a controlledthickness over the first metal plate 192 to form a cavity above thefirst plate 192. The resulting structure is illustrated in FIG. 35. Thethickness of metal frame 194 can be selected based on the height of thesandwich structure. In some embodiments, the thickness of metal frame194 is close to or identical to that of the sandwich structure. Metalframe 194 has a uniform thickness. In some embodiments, the tolerance ofthe metal frame 194 is less than +/−0.002 inch, for example, +/−0.001 or+/−0.0005 inch. The metal frame 194 is fixed onto the first metal frame192 using an adhesive in some embodiments. Examples of a suitableadhesive include but are not limited to cyanoacrylate, epoxy and anyother suitable adhesive or combination thereof. In some embodiments, amold having a cavity can be also made and used.

At step 206, sandwich structure comprising an inlayer layer and acrosslinkable polymer composition is applied into the cavity above thefirst metal plate 192. The resulting structure is illustrated in FIG.36.

At step 208, a second metal plate 196 is placed above the metal frame194. The resulting structure is illustrated in FIG. 37. The second metalplate 196 has a polished surface in some embodiments. Example of thesecond metal plate 196 include but are not limited to steel and anyother suitable metal. In some embodiments, the second metal plate 196 isa surface on an apparatus or machine for thermal lamination.

At step 210, the sandwich structure inside the cavity above the firstmetal frame can be cured under pressure and heat, for example, asuitable thermal lamination condition, as described in step 36 and 38 ofFIG. 8. The tolerance for the core layer for an information carryingcard is smooth and uniform. In some embodiments, the thickness toleranceof the information carrying card is equal to or less than +/−0.002 inch,for example, +/−0.001 or +/−0.0005 inch.

2. Information Carrying Cards

In some embodiments, an information carrying card comprises a core layerdescribed above. In some embodiments, the information carrying cardfurther comprises at least one printable thermoplastic film laminatedonto the surface of the core layer. The information carrying cardfurther comprises at least one transparent film laminated onto thesurface of the printable thermoplastic film in some embodiments. Theinformation carrying card further comprises at least one batteryinterconnected with the at least one electronic component in the inlaylayer in some embodiments. The information carrying card may alsocomprise at least one sheet of metal, ceramic, metal containingmaterial, ceramic containing material, plastics or the like.

In some embodiments, the invention also provides a method forfabricating an information carrying card. The method comprises forming acore layer of the information carrying card in this disclosure. Themethod may further comprise heat laminating a printable thermoplasticfilm and a transparent thermoplastic film on at least one side of thecore layer of the information. In some embodiments, a printablethermoplastic film is laminated on one side of the core layer of theinformation carrying card. A transparent thermoplastic film is laminatedon the printable thermoplastic film. In some embodiments, a printablethermoplastic film is laminated on each side of the core layer of theinformation carrying card. A transparent thermoplastic film is thelaminated on the printable thermoplastic film on each side of the corelayer of the information carrying card.

Referring to FIGS. 27-32, an exemplary process 150 of making anexemplary information carrying card includes the following steps asshown in FIG. 32. The layer structure at different steps of an exemplaryprocess 150 is shown in FIGS. 27-31. Referring to FIG. 27, a transparentfilm 132 is provided first. A transparent film 132 can be used as theouter layer of an information carrying card. Examples of transparentfilm 132 include but are not limited to PVC and PET. In step 152 of FIG.32, referring to the structure shown in FIG. 28, a printablethermoplastic film layer 134 is disposed onto the transparent film 132.The printable thermoplastic film 134 is an imaging receiving layer.Words or images can be printed onto the printable thermoplastic film 134before or during a process of making an information card. In someembodiments, this film is not transparent, and contains some pigmentssuch as white pigments.

In step 154 of FIG. 32, a core layer 80 is disposed onto the printablethermoplastic layer 134 and the transparent film 132. One resultingexemplary layer structure is shown in FIG. 29. Referring again to FIG.14, in some embodiments, an exemplary core layer 80 comprises a firstthermoplastic layer 6, an inlay layer 8, and a cross-linked polymercomposition 16. Inlay layer 8 comprises electronic components 10, forexample, at least one printed circuit board (PCB), supporting film 12and interconnects 14. The electronic components, such as a battery andan active or passive electronic components 10, are connected withinterconnects 14. Electronic components 10 are embedded orsurface-mounted on supporting film 14. Cross-linked polymer composition16 fills the voids and remaining spaces inside the cavity on firstthermoplastic layer 6 and inlay layer 8. In some embodiments,cross-linked polymer composition 18 directly contacts the outer surfaceof electronic components 10.

In step 156 (FIG. 32), a second printable thermoplastic layer 134 isdisposed onto the layered structure of FIG. 29, followed by a secondtransparent film 132. The exemplary resulting layer structures are shownin FIG. 30 and FIG. 31. In some embodiments, at least one release filmis used on each side of the layer structure of FIG. 31. Referring toFIGS. 1 and 2, examples of the release film include a sheet ofpolytetrafluoroethylene, any other fluoropolymer, silicone, afluoropolymer or silicone coated films. In some embodiments, abreathable release film is used.

In step 158 (FIG. 32), the exemplary layer structure after step 156 islaminated under a pressure at a raised temperature. The layeredstructure after step 156 is pressed under a pressure. In someembodiments, the pressure is less than 2 MPa. The layered sandwichstructure is then is heated at a raised temperature under the pressure.A suitable temperature is sufficiently high so that all the films arelaminated with good adhesion. In some embodiments, the temperature is inthe range of 65-232° C. In some embodiments, the temperature is lessthan 150° C. The information carrying card may have different sizes. Insome embodiments, the information card may have a size following ISO/IEC7810 standard. For example, an ID-1 type smart card, which is for mostof the banking card and ID cards, has a size of 85.6×53.98 mm.

In some embodiments, the exemplary process 150 comprises a process suchas surface treatment to improve adhesion between two layers. Examples ofsurface treatment methods include but are not limited to plasmatreatment or corona treatment before hot lamination at step 158.

The exemplary processes 20 (or 21) and 150 can be used to make aplurality of information carrying cards on one sheet, in accordance withsome embodiments. Referring to FIG. 33, in such process, a firstthermoplastic layer 6 comprises a plurality of cavity, in which an inlaylayer 8 is disposed partially or fully into each cavity. Referring toFIG. 33, like items are indicated by like reference numerals, anddescriptions of the structure, provided above with reference are alsodescribed above.

An exemplary core layer structure 180 comprising a plurality of inlaylayer 8 can be fabricated using process 20 or 21 as described above. Insome embodiments, each inlay layer 8 is fixed onto the firstthermoplastic layer 6 with an instant adhesive 115 using an exemplaryprocess 120 (FIG. 26). Each inlay layer 8 is cut with a plurality ofholes before an instant adhesive 115 is applied. Referring again to FIG.14, in some embodiments, an exemplary core layer 80 also comprises across-linked polymer composition 18. Inlay layer 8 comprises electroniccomponents 10, for example, at least one printed circuit board (PCB),supporting film 12 and interconnects 14. Cross-linked polymercomposition 18 fills the voids and remaining spaces inside the cavity onfirst thermoplastic layer 6 and inlay layer 8. In some embodiments,cross-linked polymer composition 18 directly contacts the outer surfaceof electronic components 10.

Referring again to FIG. 5, a crosslinkable polymer composition 16 isdisposed over the inlay layer inside each cavity to form the crosslinkedpolymer composition 18. An exemplary crosslinkable composition comprisesa curable precursor with or without fillers. The curable precursor isurethane acrylate, ester acrylate, silicone acrylate, epoxy acrylate,acrylates including methacrylate, silicone, urethane, epoxy or the like.The crosslinkable composition 16 is cured to form a crosslinkedcomposition 18. Examples of curing method include but are not limited tothermal and radiation curing. In some embodiments, thermal curing occursduring a thermal lamination process.

In some embodiments, the exemplary core layer structure 180 is furtherlaminated with at least one printable thermoplastic layer and atransparent film. The resulting laminated structure is then cut to forma plurality of information carrying cards. In some embodiments, thepressure is preferably less than 2 MPa. The temperature is in the rangeof 65-232° C. in some embodiments, and is preferably less than 150° C.in some embodiments in the lamination process.

In some embodiments, in the method of fabricating an informationcarrying card, laminating the printable thermoplastic film andlaminating the transparent thermoplastic film are performed underpressure at a raised temperature, as described above. The pressure canbe less than 2 MPa. The raised temperature can be in the range of from65° C. to 232° C. Laminating the printable thermoplastic film andlaminating the transparent thermoplastic film are performed below orabove at least one polished metal surface. The tolerance for theinformation carrying card is smooth and uniform. In some embodiments,the thickness tolerance of the information carrying card is equal to orless than +/−0.002 inch, for example, +/−0.001 or +/−0.0005 inch.

Rectangular shaped information carrying cards or smart cards in thisdisclosure are for illustration only. The disclosure structure andprocess of making also apply to any information carrying card or part ofany shapes and any size. Examples of these parts include but are notlimited to rectangular sheets, circular sheets, strips, rods and rings.The size includes but is not limited to any size following ISO/IEC 7810standard.

Although the subject matter has been described in terms of exemplaryembodiments, it is not limited thereto. Rather, the appended claimsshould be construed broadly, to include other variants and embodiments,which may be made by those skilled in the art.

What is claimed is:
 1. A method for forming a core layer of aninformation carrying card, comprising: forming a first thermoplasticlayer having at least one cavity, the first thermoplastic layercomprising at least one thermoplastic material; disposing at least aportion of an inlay layer into the at least one cavity; dispensing acrosslinkable polymer composition over the inlay layer to form asandwich structure comprising the first thermoplastic layer, the inlaylayer and the crosslinkable polymer composition; and curing thecrosslinkable polymer composition under pressure to form a crosslinkedpolymer composition.
 2. The method of claim 1, wherein the crosslinkablepolymer composition comprises: a curable precursor, the curableprecursor selected from the group consisting of acrylate, methacrylate,urethane acrylate, silicone acrylate, epoxy acrylate, methacrylate,silicone, urethane and epoxy, and the crosslinkable polymer compositionis a liquid or a paste.
 3. The method of claim 1 further comprisingapplying vacuum to the crosslinkable polymer composition.
 4. The methodof claim 3 further comprising disposing a second thermoplastic layerabove the first thermoplastic layer after applying the crosslinkablepolymer composition over the inlay layer.
 5. The method of claim 4wherein the first and second thermoplastic layer comprises athermoplastic material selected from the group consisting of polyvinylchloride, copolymer of vinyl chloride, polyolefin, polycarbonate,polyester, polyamide, and acrylonitrile butadiene styrene copolymer(ABS).
 6. The method for claim 1 further comprising: providing at leasta release film above and below the first thermoplastic layer.
 7. Themethod claim 6 wherein one of the at least one release film comprises abreathable release film.
 8. The method of claim 3 wherein curing thecrosslinkable polymer composition under pressure comprising pressing thesandwich structure between two metal plates spaced by a metal framehaving a controlled thickness.
 9. The method of claim 8 wherein the twometal plates have a polished surface.
 10. The method of claim 8 whereincuring the crosslinkable polymer composition under pressure comprising:providing a first metal plate; placing a metal frame with a controlledthickness over the first metal plate to form a cavity above the firstplate; applying sandwich structure comprising an inlayer layer and acrosslinkable polymer composition into the cavity above the first metalplate; and placing a second metal plate above the metal frame.
 11. Themethod of claim 10 wherein: the metal frame is fixed onto the firstmetal frame using an adhesive.
 12. The method of claim 10 furthercomprising: pressing the sandwich structure under a pressure; andheating the sandwich structure at a raised temperature under thepressure.
 13. The method for claim 11 wherein the pressure is less than2 MPa, and the raised temperature is less than 150° C.
 14. The method ofclaim 1 wherein forming the first thermoplastic layer having at leastone cavity comprises: die-cutting one or more thermoplastic films; andlaminating the one or more thermoplastic films under a heatingcondition.
 15. The method of claim 1 wherein the inlay layer comprisesat least one electronic component, wherein the at least one electroniccomponent is partially or fully disposed inside the cavity over the atleast one thermoplastic layer.
 16. The method of claim 15 wherein the atleast one electronic component in the inlay layer comprises at least oneintegrated circuit.
 17. The method of claim 15 wherein the at least oneelectronic component in the inlay layer comprises at least one lightemitting diode (LED) component.
 18. The method of claim 15 furthercomprising forming an inlayer having a display module configured todisplay information in an information carrying card comprising the corelayer.
 19. The method of claim 15 wherein a battery is connected withthe at least one electronic component.
 20. The method of claim 1 furthercomprising disposing at least one of a metal containing sheet and aceramic containing sheet.
 21. A method for fabricating an informationcarrying card, comprising forming a core layer of the informationcarrying card according to claim
 1. 22. A method for fabricating aninformation carrying card of claim 21 further comprising laminating aprintable thermoplastic film on one side of the core layer of theinformation carrying card.
 24. A method for fabricating an informationcarrying card of claim 22 wherein a printable thermoplastic film islaminated on each side of the core layer of the information carryingcard.
 23. A method for fabricating an information carrying card of claim22 wherein a printable thermoplastic film is laminated on each side ofthe core layer of the information carrying card.
 24. A method forfabricating an information carrying card of claim 21 further comprisinglaminating a transparent thermoplastic film on the printablethermoplastic film on one side of the core layer of the informationcarrying card.
 25. A method for fabricating an information carrying cardof claim 24 wherein a transparent thermoplastic film is laminated on theprintable thermoplastic film on each side of the core layer of theinformation carrying card.
 26. A method for fabricating an informationcarrying card of claim 24 wherein laminating the printable thermoplasticfilm and laminating the transparent thermoplastic film are performedunder pressure at a raised temperature.
 27. A method for fabricating aninformation carrying card of claim 26 wherein the pressure is less than2 MPa, and the raised temperature is in the range of from 65° C. to 232°C.
 28. A method for fabricating an information carrying card of claim 26wherein laminating the printable thermoplastic film and laminating thetransparent thermoplastic film are performed below or above at least onepolished metal surface.